 | Innovative Paste Printer（HSP/QSP series） |
Multiple substrates stencil printing application with precisely fiducial mark alignment, auto print with motor squeegee, auto clean for stencil and strips auto load/unload. The system provide robust printing quality and high throughput. |
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 | Contact Angle measuring system（HCA series） |
| A full-auto load/unload contact angle measuring system. To provide auto droplet control, auto dispensing and contact angle auto measuring. The droplet dispensing position is also programmable. For the option, HPC provide semi-auto and manual system for contact angle measuring. |
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 | Semi-auto 3rd Optical inspection system（IBS series） |
| To provide an simple and manual inspection environment for Die-bonding & wire-bonding products , the system provide convenient functions for hand-free, easy operation, easy change kit and web-service. Also to avoid the products be damaged and improve the inspection method and speed. |
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 | Wafer/paste measuring system（HyperScan series） |
| To measure the paste thickness / die thickness / wafer thickness with a integration of precisely laser sensor, linear motor XY table, granite stage. It provide an easy and fast function for the measurement application. |
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 | Fillet-height measuring system（FHM-20/30） |
| To measure the fillet height thickness and calculate the percentage with microscope and million pixel CCD . It could improve current measure way and speed for calculation. |
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 | Wafer inspection system（SBS-300+） |
| When loading wafer to inspection platform automatically, SBS-300+ can take sequence photos of wafer sawing street for eye inspection. This automatic wafer handling function can make it a lot easier to do the eye inspection. |
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 | Auto wafer thickness measuring system（WFSCAN-20） |
| WFSCAN-20 is a fully automatic wafer thickness measuring machine which contains automatic wafer load/unload function and wafer thickness measuring system. WFSCAN-20 equipt with a high precision laser head, a linear motor and a granite platform for the excellent performance. |
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 | Paste shape and position inspection System（PI-100）
Paste shape and position inspection to make sure printing quality. In-line and Stand along type are both available. |
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 | Die Sorting System（HDS-200）
A speedy driver IC sorter equipped with 6 waffle-tray bins, and optional back-side inspection function. |
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 | Wafer skeleton inspection（WS-100）
To scan skeleton die images and analysis / compare to original map file , the process is after die-bond. |
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 | Auto refill system（ATX-100）
To re-fill IC to the unfilled tray after trim/form process. |