In order to stay highly competitive globally as well as domestically, we have been focusing on developing our products through our own researches and technologies. Our lines include additives, corrosion inhibitors, cleaners, activators and a catalyst as well as eco-friendly products related to electronic components, such as semi-conductor, PCB, and cellular phones. Also focus on wafer base bumping process, we provide MS-AG80 ( SnAg ) and MS-CP70 ( Cu Pillar ) solution and provide high ASD and high quality material to customer.
MSC Overview:
Founded 2005
Historical Basis : Surface-Treatment Chemicals
2 Plants in Korea, and 1 Plant in China
Certified ISO9001, 14001 & OHSAS System
Focusing R&D : 15% in total head counts Class 1,000
Max. capa 7-10 tons per month
Automatically controlling and monitoring in-line process
MS-AG80(SnAg)
Design Concepts
Comparison Data
Beta site apply to apply comparison
Item | High speed candidate |
Model | Competitor A | Competitor B | MS-AG80 |
PR Leaching | AZ4620 | Pass | Pass | Pass |
AZP40XT | Pass | Pass | Pass |
Optimized plating rate (ASD) | 6um/min (12) | 4um/min (8) | 6um/min (12) |
Uniformity after reflow (WID, <5%) | Max. 4.64 | Max. 4.72 | Max. 1.7 |
Uniformity after reflow (WIW, <10%) | Max. 7.98 | Max. 14.1 | Max. 4.38 |
Ag composition (Max %) | 3.11 | 3.9 | 1.9 |
Bump surface after reflow | Good | Wrinkle | Good |
Make-up cost ($ / L) | High | High | Low |
Material Cost ($ / wafer) | High | High | Low |
Process Cost ($ / wafer) | Middle | High | Low |
►MS-AG80 showed a better position in terms of material quality and cost
MS-CP70 ( Cu Pillar )
Design Concepts
High deposition rate, more than 10 ASD (range 4-22 ASD)
Minimize or eliminate micro void during plating process
Using the purified raw materials to meet an excellent uniformity and RoHS requirement
Meet to customer CTQs
Cost attractiveness
Plating Simulation with TSV
Solution | TSV Type | Machine |
Base : 280mL
Suppressor :10mL
Leveler :2mL
Accelerator :10mL | | |
10ASD
| 12ASD
| 14ASD
| 16ASD
| 18ASD
|
►No issue Cu plating at 10-18 ASD
Application for process
« Bumping »
« Cu Pillar »
| |
Pb-Free Bump | Cu Pillar & u-Pillar |
Diameter | 75-150um | Diameter | 20-100um |
Product | MS-AG80 (High ASD Version) MS-AG40 (Low ASD Version) | Product | MS-AG80(SnAg) MS-CP70(Cu) |