Diamaflow dicing solutions are formulated by Keteca USA., Inc. to specifically solve the problem of silicon dust on semiconductor wafers after the die separation process.
Diamaflow are formulated using several special precision cleaning, surface-active, nonionic surfactants, each selected for a specific purpose. |
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  Diamaflow will reduce the surface tension and will increase the conductivity of D.I water, allowing the D.I water to maintain a film on the wafer surface The reduced surface tension of the D.I water can penetrate deeper into the saw cut, removing the silicon dust more effectively, and helps cool the dicing blade Silicon dust will be encapsulated and washed off the wafer during the dicing process and the wafer cleaning process Diamaflow contains lubricant, which makes the cutting with less pressure and friction, resulting in less chipping Improves ball shear test results Prevents galvanic corrosion on Al/Cu bonding pads | |||||||||||