Gaiser Capillary

IC FT/CP Test

IC Assembly

Capillary[CoorsTek Gaiser Brand]

Epoxy[Yiztech]

Diamaflow[Keteca]

DDR2/DDR3 Printer[Hypersonic]

Plasma[Tepla]

Lead Frame Tape[TAK]

Conductive Paste[Ormet]

Wafer Manufacture

Wafer Bump[Aceris 3D]

Thin Wafer Handling[Protec]

PCB Manufacture

AOI/AVI[KGK]

Region Contact:
East China:	0512-62519991
South China:	0769-68150313
West China:	028-86798186
North China:	022-23156381

Gaiser?brand precision bonding tools are superior wire bonding tools for the semiconductor and hybrid micro-electronics industries. These tools include capillaries and fine-pitch capillaries for gold and copper ball bonding, small and large wire wedges for gold and aluminum wire, ribbon wedges, ceramic/cermet wedges, die collets & vacuum pick-up tools, parallel gap electrodes (PGE's), waffle tools for the disk drive industry, specialty nozzles, and a high-precision job shop. [Gaiser]

Compression Bonding:
Generally consists of gold-togold bonding; force, time, surface area, metallization quality and cleanliness are the key variables.

Thermo-Compression Bonding:
Heat is added in addition to compression in the form of tool-heat, stageheat, or both. The capillary or device may be heated. A capillary is generally heated by a radiant coil and the device to be bonded is usually clamped to a heated stage.

Thermo-Sonic Bonding:
Ultrasonic energy is applied in the application to the capillary through an ultrasonic transducer. Ultrasonic energy provides a mechanical scrubbing action, which consequently generates frictional heat, to the thermo-compression bonding process.

Ultrasonic Bonding:
Ultrasonic energy is applied in the application to the capillary through an ultrasonic transducer. The Ultrasonic energy provides a mechanical scrubbing action which generates frictional heat. Heat in the form of a heated tool or device may or may not be available.